In terms of space, stacked chip inductors are small in size; conducive to the miniaturization of the circuit; and the magnetic circuit is closed, will not interfere with other components around; at the same time, the stacked chip inductors themselves will not be interfered with by the adjacent components; conducive to the high-density installation of components; integrated structure; greatly reducing the space volume. And stacked inductors have high reliability; high temperature and heat resistance; good solderability; regular shape and volume; can be conducive to automated production and installation of machinery and equipment;
Stacked chip inductors have good magnetic shielding, high sintering density, and good mechanical end strength; the shortcomings are low qualification rate, high cost, small inductance, and low Q value.
2、Ceramic Body Chip Wirewound Inductors Features:
It is characterized by a wide range of inductance, high accuracy of inductance, small loss (i.e., large Q), high allowable current, strong inheritance of the production process, simplicity, low cost, and so on.
The disadvantage is that further miniaturization is limited.
Wirewound chip inductors with ceramic cores are able to maintain stable inductance and fairly high Q values at such high frequencies, and are therefore more widely used in high frequency circuits.
3、SMD Power Inductor Features:
Characterized by larger inductance per unit volume at 1MHz than other chip inductors, small size, and easy mounting on substrate. Used as miniature magnetic components for power processing. Flat bottom surface is suitable for surface mounting; excellent end strength and good solderability; characterized by high Q and low impedance; and shielded magnetic enclosure protects the leakage rate to a minimum to ensure the best results.
Due to the mounted power inductor in the circuit can realize the characteristics of low direct resistance, resistance to high current; so the application of special stickers are widely used in digital products, PDA, laptop computers, cell phones, network communications, graphics cards, LCD backlighting, power supply modules, automotive electronics, security products, office automation, home appliances, walkie-talkies, electronic toys, sports equipment and medical instruments.
Surface Mount High Power Inductors.
Miniaturization, high quality, high energy storage and low resistance.
Mainly used in computer display boards, notebook computers, pulse memory program design, applied to DC-DC conversion.
Reel packaging is available for automatic surface mounting.
4、High Current Power Inductor
Flat bottom surface is suitable for surface mounting.
Excellent end strength and good solderability.
It is characterized by high Q value and low impedance.
Low leakage magnetism, low direct resistance and high current resistance.
Available in tape and reel packaging for automated assembly
The inductance per unit volume at 1MHz is larger, smaller, and easier to mount on a substrate than other chip inductors.
The products are widely used in
Digital products, PDAs, notebook computers, cell phones, network communications, graphics cards, LCD backlighting, power modules, automotive electronics, security products, office automation, home appliances, walkie-talkies, electronic toys, sports equipment and medical instruments.