1、Brackets:
1）、The role of the bracket: used to conduct electricity and support
2）、Composition of the bracket: The bracket is formed by plating the bracket material, and is composed of five layers: material, copper, nickel, brass, and silver from the inside out.
3）、Types of brackets: Lamps with cup brackets for spotlighting and flush brackets for large angle diffusion.
A、2002 cup/flat head: this kind of bracket generally do to the angle, brightness is not very high requirements of the material, its Pin long than the other bracket to be shorter than the other bracket about 10mm.Pin spacing is 2.28mm.
B、2003 Cup/Flat: Generally used for Lamps above φ5, with exposed pin lengths of +29mm and -27mm. pin spacing of 2.54mm.
C、2004 Cup/Flat Head: Used for φ3 or so Lamp, Pin length and spacing is the same as 2003 bracket.
D、2004LD/DD: Used to make blue, white, pure green and purple Lamps, can be soldered with double wires and deeper cups.
E、2006: Both poles are flat head type, used for flashing Lamp, solid IC, soldering multiple wires.
F、2009: Used to make a two-color Lamp, two wafers can be fixed in the cup, and three pin pins control the polarity.
G、2009-8/3009: Used to make three-color Lamp, three wafers can be fixed in the cup, four pin feet.
2、silver gel
The role of the silver glue: fixed wafer and conductive role.
The main ingredients of silver glue: silver powder accounts for 75-80%, EPOXY (epoxy resin) accounts for 10-15%, additives account for 5-10%.
Use of silver glue: refrigerated, thawed and fully stirred before use, because silver glue placed for a long time, silver powder will precipitate, such as not stirring evenly will affect the performance of silver glue.
3、wafers（Chip）：
Structural composition of LED beads and LED chips
1）、The role of the wafer: the wafer is the main component material of the LED Lamp, is the light-emitting semiconductor material.
2）、Composition of the wafer: The wafer is made of gallium phosphide (GaP), gallium aluminum arsenic (GaAlAs) or gallium arsenide (GaAs), gallium nitride (GaN) and other materials, and its internal structure has a unidirectional conductivity.
3）、The structure of the wafer:
Soldering single-wire positive polarity (P/N structure) wafers, dual-wire wafers. Wafer size unit: mil
The solder pads for wafers are generally gold or aluminum pads. Their solder pad shapes are round, square, cross-shaped, etc.
4）、The luminescent color of the wafer:
The color of light emitted by the wafer depends on the wavelength, and common visible light is broadly classified as: dark red (700nm), crimson (640-660nm), red (615-635nm), amber (600-610nm), yellow (580-595nm), yellowish-green (565-575nm), pure green (500-540nm), blue (450-480nm), and violet (380-430nm).
White and pink light is a light mixing effect. It is most commonly created by mixing blue light + yellow phosphor and blue light + red phosphor.
5）、The main technical parameters of the wafer:
A、Volt-ampere characteristic diagram of the wafer:
B、Voltage Forward (VF): The voltage applied across the wafer that causes the wafer to conduct positively. This voltage is related to the wafer itself and to the test current, and an excessively large VF will cause the wafer to break down.
C、Inward Current (IF): The positive conduction current generated by the wafer after applying a certain voltage. the size of IF is related to the size of the inward voltage. The operating current of the wafer is around 10-20mA.
D、Reverse Voltage (VR): The reverse voltage applied to the wafer.
E、Inverse Current (IR): This is a leakage current that occurs when a reverse voltage is applied to a wafer. The smaller this current is, the better. Because a large current will easily cause the wafer to be broken down in reverse.
F、Brightness (IV): refers to the brightness of the light source. Unit conversion: 1cd = 1000mcd
G、Wavelength: Reflects the light-emitting color of the wafer. The wavelength of the wafer is different from the wavelength of the light-emitting color. Unit: nm
H、Light: is a kind of electromagnetic wave. Wavelength in 0.1mm-10nm of electromagnetic waves called light.
Light can be divided into: wavelength greater than 0.1mm is called electric wave; 760nm-0.1nm is called infrared light; 380nm-760nm is called visible light; 10nm-380nm is called ultraviolet light; wavelengths of less than 10nm is X-ray light.
4、Gold thread：
Function of the gold wire: connects the wafer PAD (solder pad) to the holder and enables it to conduct.
The purity of the gold wire is 99.99% Au; the elongation is 2-6%, and the sizes of the gold wire are: 0.9mil, 1.0mil, 1.1mil, and so on.
5、Epoxy Resin:
The role of epoxy resin: to protect the internal structure of the Lamp, can slightly change the color, brightness and angle of the Lamp's light-emitting; make the Lamp shape.
The encapsulation resin consists of four parts: A glue (main agent), B glue (hardener), DP (diffuser), CP (colorant). Its main components are epoxy resin (Epoxy Resin), acid anhydride (acid anhydride), high light diffusion filler (Light diffusion) and thermal stability dye (dye).
6、mold bar：
Mold bars are the molds used for Lamp shaping and are generally round, square, and tower shaped. The depth of the support is determined by the height of the clamping point of the mold strip. Mold bars should be stored in a clean environment and below room temperature, otherwise it will affect the appearance of the product.